阿普奇 E7L-H610 | 多串口多USB 無風(fēng)扇擴(kuò)展型工控機(jī)
遠(yuǎn)程管理
狀態(tài)監(jiān)控
遠(yuǎn)程運(yùn)維
安全控制
聯(lián)系我們
掃碼即可添加微信，售前客服為您提供咨詢服務(wù)
阿普奇 E7L-H610 | 多串口多USB 無風(fēng)扇擴(kuò)展型工控機(jī)
產(chǎn)品描述
阿普奇 E7L-H610 是E7L系列無風(fēng)扇擴(kuò)展型嵌入式工控機(jī)的12-14代最新旗艦——在E7L-H81（4/5代）的傳奇機(jī)箱（268×194mm, 全鋁合金無風(fēng)扇被動散熱）中，將平臺全面升級到LGA1700桌面級，是阿普奇無風(fēng)扇嵌入式品類的性能頂峰。
核心平臺跨越式升級：Intel 12/13/14代Core/Pentium/Celeron桌面處理器（35W TDP, LGA1700可更換接口）。H610芯片組。2×DDR4 SO-DIMM 3200MHz雙通道（64GB）——內(nèi)存容量和帶寬是H81的DDR3-1600 16GB的4倍。12-14代P-core+E-core混合架構(gòu)在同35W TDP下性能大幅領(lǐng)先4/5代。
網(wǎng)絡(luò)升級到2.5GbE時(shí)代：i219-LM/V（1GbE管理網(wǎng)口）+ i225-V/LM（2.5GbE高速網(wǎng)口）——2.5GbE為視覺傳感器和高帶寬數(shù)據(jù)提供更高的吞吐能力。
顯示接口現(xiàn)代化建設(shè)：HDMI 1.4b（4096×2160@30Hz）+ DP 1.4a（4096×2160@60Hz）+ LVDS（1920×1200@60Hz, wafer內(nèi)置）三路顯示——將H81的老舊DVI-D和VGA替換為HDMI和DP 4K@60Hz。
存儲全線SATA3.0：2×SATA3.0（1×快拆2.5寸≤7mm + 1×內(nèi)置2.5寸≤9mm選配）+ M.2 Key-M（SATA3.0, 2280）+ 3×SATA 7Pin + 3×SATA Power——雙盤位快拆+4路SATA接口覆蓋RAID等多盤需求。
USB跨代升級：前置USB 10Gbps（2×USB3.2 Gen2x1）+ 5Gbps（2×USB3.2 Gen1x1）+ USB2.0×2 + 6路內(nèi)置USB2.0(wafer) = 12路。
擴(kuò)展系統(tǒng)進(jìn)化：aDoor總線替代MXM（提供4LAN/4PoE/6COM/16GPIO模塊）+ Mini PCIe升級到PCIe3.0 x1（含Nano SIM）+ E7DL版本保留PCIe x16或2×PCI標(biāo)準(zhǔn)擴(kuò)展槽。
電源系統(tǒng)突破：DC 9-36V（P≤240W）和DC 18-60V（P≤400W）雙電壓范圍——新增60V支持鐵路、大型工業(yè)設(shè)備和直流高壓系統(tǒng)。AT/ATX切換按鍵+OS Recovery按鍵（硬件級一鍵系統(tǒng)還原）新增。
LGA1700桌面12-14代+DDR4 64GB+2.5GbE+USB10G+DP4K+9-60V——E7L-H610代表了無風(fēng)扇嵌入式工控機(jī)的當(dāng)前最新技術(shù)水平。
|
Model |
E7L |
E7DL |
|
|
CPU
|
CPU | Intel? 12/13th Generation Core / Pentium/ Celeron Desktop CPU | |
| TDP | 35W | ||
| Socket | LGA1700 | ||
| Chipset | H610 | ||
| BIOS | AMI 256 Mbit SPI | ||
|
Memory |
Socket | 2 * Non-ECC SO-DIMM Slot, Dual Channel DDR4 up to 3200MHz | |
| Max Capacity | 64GB, Single Max. 32GB | ||
|
Graphics |
Controller | Intel??UHD Graphics | |
|
Ethernet |
Controller | 1 * Intel i219-LM/V 1GbE LAN Chip (LAN1, 10/100/1000 Mbps) 1 * Intel i225-V/LM 2.5GbE LAN Chip (LAN2, 10/100/1000/2500 Mbps) |
|
|
Storage |
SATA | 1 * SATA3.0, quick release 2.5-inch hard drive bay (T ≤ 7mm) 1 * SATA3.0, Internal 2.5" hard disk bays (T≤9mm, Optional) |
|
| M.2 | 1 * M.2 Key-M (SATA3.0, 2280) | ||
|
Expansion Slots |
PCIe Slot | N/A | ①: 1 * PCIe x16 (x16)②: 2 * PCI
PS: ①、②One out of two, Expansion card length ≤ 185mm, TDP ≤ 130W |
| aDoor | 1 * aDoor Bus (Optional 4 * LAN/4 * POE/6 * COM/16 * GPIO expansion card) | ||
| Mini PCIe | 1 * Mini PCIe (PCIe3.0 x1 + USB 2.0, with 1*Nano SIM Card) | ||
|
Front I/O |
Ethernet | 2 * RJ45 | |
| USB | 2 * USB3.2 Gen2x1(Type-A, 10Gbps) 2 * USB3.2 Gen1x1(Type-A, 5Gbps) 2 * USB2.0 (Type-A) |
||
| Display | 1 * HDMI1.4b: max resolution up to 4096*2160 @ 30Hz 1 * DP1.4a: max resolution up to 4096*2160 @ 60Hz |
||
| Audio | 2 * 3.5mm Jack (Line-Out + MIC) | ||
| Serial | 2 * RS232/422/485 (COM1/2, DB9/M, Full Lanes, BIOS Switch) 2 * RS232 (COM3/4, DB9/M, Full Lanes) |
||
| Button | 1 * Power Button + Power LED 1 * AT/ATX Button 1 * OS Recover Button 1 * System Reset Button |
||
|
Rear I/O |
Antenna | 4 * Antenna hole | |
| SIM | 1* Nano SIM card slot (SIM1) | ||
|
Internal I/O |
USB | 6 * USB2.0 (wafer) | |
| LCD | 1 * LVDS (wafer): max resolution up to 1920*1200 @ 60Hz | ||
| Front Panel | 1 * FPanel (PWR + RST + LED, wafer) | ||
| Audio | 1 * Audio (Header) 1 * Speaker (2-W (per channel)/8-Ω Loads, wafer) |
||
| Serial | 2 * RS232 (COM5/6, wafer) | ||
| GPIO | 1 * 16 bits DIO (8xDI and 8xDO, wafer) | ||
| LPC | 1 * LPC (wafer) | ||
| SATA | 3 * SATA 7P Connector, up to 600MB/s | ||
| SATA Power | 3 * SATA Power (wafer) | ||
| FAN | 1 * CPU FAN (wafer) 2 * SYS FAN (KF2510-4A) |
||
|
Power Supply |
Type | DC, AT/ATX | |
| Power Input Voltage | 9~36VDC, P≤240W 18~60VDC, P≤400W |
||
| Connector | 1 * 4Pin Connector, P=5.00/5.08 | ||
| RTC Battery | CR2032 Coin Cell | ||
|
OS Support |
Windows | Windows 10/11 | |
| Linux | Linux | ||
|
Watchdog |
Output | System Reset | |
| Interval | Programmable 1 ~ 255 sec | ||
|
Mechanical |
Enclosure Material | Radiator: Aluminum alloy, Box: SGCC | |
| Dimensions | 268mm(L) * 194.2mm(W) * 67.7mm(H) | 268mm(L) * 194.2mm(W) * 118.5mm(H) | |
| Weight | Net: 4.5 kgTotal: 6 kg (Include packaging) | Net: 4.7kgTotal: 6.2 kg (Include packaging) | |
| Mounting | VESA, Wall mounted, Desktop | ||
|
Environment |
Heat Dissipation System | Fanless Passive Cooling | |
| Operating Temperature | -20 ~ 60℃?(Industrial SSD) | ||
| Storage Temperature | -40 ~ 80℃?(Industrial SSD) | ||
| Relative Humidity | 10 to 90% RH (non-condensing) | ||
| Vibration During Operation | With SSD: IEC 60068-2-64 (3Grms@5~500Hz, random, 1hr/axis) | ||
| Shock During Operation | With SSD: IEC 60068-2-27 (30G, half sine, 11ms) | ||
| Certification | CE/FCC, RoHS | ||
-
嵌入式工控機(jī)/BOX E7L系列H610平臺
